PURPOSE: To obtain ICs, which have the same external shape and terminal arrangement thereof forms a pair of reflection symmetry, by casting a resin, separating a connecting section for a lead frame, bending the end section of a lead section in either direction to the surface of the lead section and shaping a terminal.
CONSTITUTION: An IC chip 1 is fixed to a die pad section 3 for a lead frame, and electrodes for the chip 1 and lead sections 4 for the lead frame are connected through wire bonding. The lead sections 4 are fastened to a molding die so as to be projected to the center in the thickness direction of a resin body, and a resin is casted. The leads are formed, but the end sections of the lead sections 4 are bent to the side reverse to a semiconductor mounting surface for the lead frame and terminals 7 are shaped in one lead sections while the end sections of the lead sections 4 are bent in the opposite direction in the other lead sections. Consequently, the two molded shapes take a reflection shape. Accordingly, when the two ICs are paired and disposed, terminals having the same terminal number are faced oppositely, thus facilitating connections to the same wiring conductor, then eliminating the possibility of defective wirings.
HIROHASHI OSAMU
SHIGETA YOSHIHIRO
| JPS60220961A | 1985-11-05 |
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