PURPOSE: To make position alignment between a gate electrode and a p+ diffusion region needless to upgrade integrity, by diffusing p-type impurities from a gate electrode to a semiconductor substrate just under the gate electrode.
CONSTITUTION: After a gate electrode 7 is selectively formed on a surface of an (n) layer, ramp annealing is performed to diffuse p-type impurities from the gate electrode 7 to the (n) layer 2 just under the gate electrode 7 so that a p+ diffusion region 8 is formed. A pn junction is thus formed between the (n) layer 2 and the p+ diffusion region 8. The p+ diffusion region 8 of a junction type FET composed in this way is formed with the gate electrode 7 as a diffusion source, and so fine processing can be realized sufficiently according to precision in the processing of the gate electrode 7, and also integrity can be upgraded.
JP5305696 | Processing method of semiconductor elements |
JPS6118121 | MOLECULE BEAM EPITAXY APPARATUS |
MATSUDA HIROFUMI
KOBAYASHI SHINJI
MIURA AKIRA
JPS60220975A | 1985-11-05 |