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Title:
MANUFACTURE OF LAMINATED BOARD
Document Type and Number:
Japanese Patent JPH04323032
Kind Code:
A
Abstract:

PURPOSE: To reduce the occurrence of smear defects in a laminated board and manufacture laminated boards with good productivity and high thickness accu racy.

CONSTITUTION: Continuous base materials 1 are impregnated with polybenzimidazole resin 2 and a plurality of sheets thereof are superimposed while being forwarded and further continuous metal foils 3 are put thereon. while being forwarded continuously, this is heated under non-pressure so as to harden and laminate the polybenzimidazole resin 2 integrally, after that, it is cut into a predetermined length to thereby obtain a laminated board A. Such a polybenzimidazole resin has a heat deformation temperature and thus smears occur less than usual. Because of a continuous method, the productivity becomes high and the laminated boards A are laminate-molded one by one, therefore, the dispersion of board thickness between respective laminated boards becomes small.


Inventors:
HORIBATA SOICHI
IKOMA SUNAO
Application Number:
JP9381291A
Publication Date:
November 12, 1992
Filing Date:
April 24, 1991
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B32B15/08; B32B15/088; B32B37/20; B32B43/00; H05K1/03; (IPC1-7): B32B15/08; B32B31/08; B32B35/00; H05K1/03
Attorney, Agent or Firm:
Ishida Chochichi (2 outside)



 
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