Title:
MANUFACTURE OF LAMINATED CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3044994
Kind Code:
B
Abstract:
PURPOSE: To provide a method for manufacturing a laminated ceramic electronic component, in which a ceramic laminated body can be put under uniform pressure, by storing the ceramic laminated body in a die assembly before the laminated body is put under hydrostatic pressure.
CONSTITUTION: A die assembly includes first and second pad members 23 and 24 for pushing both main faces of a ceramic laminated body 21, and a frame member 25 put around the ceramic laminated body 21 and the pad members 23 and 24. In this case, the frame member 25 functions as a guide member for moving the pad members 23 and 24 to each main face of the ceramic laminated body 21. Then, a plurality of ceramic sheets in the ceramic laminated body 21 are bonded with good adhesion, and thereby flaking in these layers can be prevented.
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Inventors:
Riyougen, Masaharu
Application Number:
JP1993000319720
Publication Date:
March 17, 2000
Filing Date:
December 20, 1993
Export Citation:
Assignee:
MURATA MFG CO LTD
International Classes:
B66B7/04; (IPC1-7): H01G4/12; H01G4/30