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Patent Searching and Data


Title:
MANUFACTURE OF LAMINATED ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH08181036
Kind Code:
A
Abstract:

PURPOSE: To reduce a distortion and to decrease an inner electrode exposure failure in the cutting step by forming a mother laminate by pressurizing it by a press mold, then cooling it by keeping the laminate, and taking out the laminate when the temperature of the mold becomes about the ambient temperature.

CONSTITUTION: When a ceramic mother laminate 6 is pressure formed, a press mold is cooled as an upper mold 5 remains set, is lowered to the ambient temperature such as, for example, 40°C or lower, then the mold 5 is lifted, and the laminate 6 is taken out from the mold. Thus, the pressing distortion of the laminate 6 in the pressing step can be suppressed, and the exposure failure of an inner electrode in next cutting step can be reduced.


Inventors:
OGAWA MAMORU
Application Number:
JP33557794A
Publication Date:
July 12, 1996
Filing Date:
December 20, 1994
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
B30B11/02; H01G4/12; H01G4/30; H01G4/40; H05K3/46; (IPC1-7): H01G4/30; B30B11/02; H01G4/12; H01G4/40; H05K3/46
Attorney, Agent or Firm:
Akira Wada