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Title:
MANUFACTURE OF LAMINATION SHEET AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH03157001
Kind Code:
A
Abstract:

PURPOSE: To easily manufacture a lamination sheet and a circuit board with a large adhesive force between a fluorine resin impregnated fiber cloth and a metallic foil by arranging a porous fluorine resin sheet in contact with the metallic foil in the case of adhering the both.

CONSTITUTION: In the case of prescribed number of fluorine resin impregnated cloth and metallic foil such as copper foil are overlapped and adhered, a porous fluorine resin sheet is interposed between them. The porous fluorine resin sheet of the same type of material as a fluorine resin impregnated in the fiber cloth such as PTFE, FEP, PFA, ETFE and PCTFE is used and the thickness is normally nearly 10-500μm, the porosity is nearly 20-95% and the porous diameter is nearly 0.01-100μm. The fluorine resin impregnated fiber cloth and the metallic foil are overlapped via the porous fluorine resin sheet, heated and pressed to melt the porous fluorine resin sheet and the fiber cloth and the metallic foil are adhered by using the sheet as an adhesives.


Inventors:
SHIBAGAKI KAZUYOSHI
IWASAKI NAOTO
UEDA ZENICHI
HONDA ZENZO
Application Number:
JP29640389A
Publication Date:
July 05, 1991
Filing Date:
November 14, 1989
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
H01Q1/38; B32B15/08; B32B15/082; H05K1/03; (IPC1-7): H01Q1/38



 
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