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Title:
MANUFACTURE OF LEADFRAME
Document Type and Number:
Japanese Patent JPH0613516
Kind Code:
A
Abstract:

PURPOSE: To offer a lead frame manufacturing method which provides a highly reliable resin-sealed semiconductor device which does not produce any troubles, such as cracks during reflow mounting or practical application by coating the surface with an inorganic film preliminarily on the raw material in order to increase bonding strength between the lead frame and sealing resin.

CONSTITUTION: At least one side of a bar-shaped lead frame raw material cut at a product thickness is dry-coated with an inorganic film. This raw material is formed and cut into the shape of a lead frame by a press process or an etching process or both the surfaces of the raw material are dry-coated with an inorganic film and the inorganic film in a specified site on the raw material surfaces is removed and then formed into the shape of a specified lead frame by the etching process, which constitute this lead frame manufacturing method.


Inventors:
OKIKAWA SUSUMU
Application Number:
JP1992000134038
Publication Date:
January 21, 1994
Filing Date:
May 26, 1992
Export Citation:
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Assignee:
NIPPON STEEL CORP
International Classes:
C23C14/10; C23F1/00; H01L21/56; H01L23/28; H01L23/50; (IPC1-7): H01L23/50; C23C14/10; C23F1/00; H01L21/56; H01L23/28
Attorney, Agent or Firm:
田村 弘明 (外1名)



 
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