PURPOSE: To provide the manufacture of a metal bond grinding wheel without requiring raising of soldering temperature as conventional, capable of easily flowing solder material into an engaging part, and with high processing accuracy and strength.
CONSTITUTION: A base metal 1 and a sintered grinding wheel 2 are formed so as to define a solder storage part 12 communicated with a gap 10 between the base metal 1 and the sintered grinding wheel 2 when they are engaged (S1, S2). Metal plating is applied to a base metal engaging surface of the sintered grinding wheel 2(S3). The base metal 1 and the sintered grinding wheel 2 are engaged to store solder material 6 in the solder storage part 12. The solder material 6 is heated and melted to solder the base metal to the sintered grinding wheel 2(S5).
| JPWO2003049903 | Manufacturing method of grindstone and optical element |
| WO/2003/057409 | ABRASIVE PRODUCT AND METHOD OF MAKING THE SAME |
TOKITSU SHIGERU
OKAWA YASUO
