To improve moldability by removing resin in a part irradiated with laser light and cutting metallic foil by a cutter, in the part from which this resin is removed.
Resin at a portion on which laser light on a resin layer 2 is irradiated is removed. A rotary blade 3 cuts a part from which the resin layer 2 is removed of the metallic foil 1. In this cutting, scattering of resin of the resin layer 2 is eliminated. Therefore, a possibility of adhesion of scattering resin to an upper surface of the resin layer 2 is eliminated, smoothness of the upper surface of the resin layer 2 is not damaged and moldability can be improved. Adhesion of scattering resin to the surface of metallic foil 1 can be prevented, conductivity of metallic foil 1 can be prevented from being damaged, and when this metallic foil with resin 1 is laminated in multilayer and a laminated plate is molded, degradation of moldability of the laminated plate due to generation of a dent in metallic foil 1 can be prevented.
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