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Title:
MANUFACTURE OF METALLIC FOIL WITH RESIN
Document Type and Number:
Japanese Patent JP3539236
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To improve moldability by removing resin in a part irradiated with laser light and cutting metallic foil by a cutter, in the part from which this resin is removed.
SOLUTION: Resin at a portion on which laser light on a resin layer 2 is irradiated is removed. A rotary blade 3 cuts a part from which the resin layer 2 is removed of the metallic foil 1. In this cutting, scattering of resin of the resin layer 2 is eliminated. Therefore, a possibility of adhesion of scattering resin to an upper surface of the resin layer 2 is eliminated, smoothness of the upper surface of the resin layer 2 is not damaged and moldability can be improved. Adhesion of scattering resin to the surface of metallic foil 1 can be prevented, conductivity of metallic foil 1 can be prevented from being damaged, and when this metallic foil with resin 1 is laminated in multilayer and a laminated plate is molded, degradation of moldability of the laminated plate due to generation of a dent in metallic foil 1 can be prevented.


Inventors:
加地 良行
大口 哲哉
Application Number:
JP1998000305074
Publication Date:
July 07, 2004
Filing Date:
October 27, 1998
Export Citation:
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Assignee:
松下電工株式会社
International Classes:
B26D7/08; B23D19/00; B23K26/38; B23K26/40; B26D9/00; B29C71/02; B29C71/04; (IPC1-7): B26D9/00; B23D19/00; B23K26/00; B26D7/08; B29C71/02; B29C71/04
Domestic Patent References:
JP61180932A
JP2219651A
JP9015871A
JP8229686A
Attorney, Agent or Firm:
西川 惠清
森 厚夫