To provide a manufacturing method of miniature electronic parts capable of miniaturizing with the direct formation of a sealing structure in a recessed part which protects a functional part without the need for complicated and minute operations.

In this manufacturing method of miniature electronic parts, a supporting substrate 7 on which a functional part 8 is formed is directly coupled with a sealing substrate 1 on whose recessed part 3 a porous part 6 is formed by anodic oxidation to form a hollow part 38 which covers the functional part 8. The supporting substrate 7 and sealing substrate 1 are arranged in a vacuum film forming device. A remaining gas in the hollow part 38 is discharged from the porous part 6 into the vacuum film forming device, and the porous part 6 is sealed by forming a film on the surface of the sealing substrate 1 to vacuum-seal the hollow part 38.