Title:
MANUFACTURE OF MOLD TYPE SEMICONDUCTOR LASER DEVICE
Document Type and Number:
Japanese Patent JPH05129731
Kind Code:
A
Abstract:
PURPOSE: To avoid the deterioration in the performance and the disconnection of a metallic wire in a semiconductor laser chip when the semiconductor laser chips are sealed with a synthetic resin made sealing material.
CONSTITUTION: Synthetic resin made frame bodies 6 formed into a frame encircling semiconductor laser chips 8 are integrally molded on the supporting plates 5 whereon the semiconductor laser chips 8 are mounted by transfer molding step and then a synthetic resin made sealing material in liquid state is poured inside the frame bodies 6.
Inventors:
TANAKA HARUO
AOKI TADASHI
AOKI TADASHI
Application Number:
JP29011991A
Publication Date:
May 25, 1993
Filing Date:
November 06, 1991
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L21/56; H01L23/08; H01S5/00; H01S5/022; (IPC1-7): H01L21/56; H01L23/08; H01S3/18
Attorney, Agent or Firm:
Akio Ishii (2 outside)