PURPOSE: To provide a method of manufacturing a multilayer ceramic board, which can reduce the warpage of the ceramic board and beats, which are generated at the time of a hot pressing and a firing, and can reduce reliably an irregularity in the thickness of the ceramic board.

CONSTITUTION: A tungsten paste is printed on a green sheet 1 with holes 2 for through hole formation and conductor circuits 3a inside through holes and the like are formed. A tungsten paste is printed extending over almost the whole surface of the sheet 1, which is used as the outermost layer, and solid patterns 4, which function as a carbonization preventive layer L1 and a step dissolving layer L2, are formed. The green sheets 1 and green sheets 5 are thermally fixed by pressure using a plurality of sheets of the sheets 1 and 5 and a laminated material 9 is formed. After a degreasing of the material 9 is performed, spacers 7 and 8 are respectively arranged on both surfaces of the material 9 to perform a hot pressing.