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Title:
MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2000151120
Kind Code:
A
Abstract:

To provide a manufacturing method of a multilayer printed wiring board with excellent etching precision of interlayer connecting holes.

In this manufacture of a multilayer printed wiring board using an epoxy resin curing compound containing halogen atoms for insulating layers, interlayer connecting holes are formed by removing the resin curing compound provided in the portions to be the interlayer connecting holes by using an etching solution consisting of alkali metal compounds, an amide solvent and an alcohol solvent and the etching solution is filtrated during the treatment.


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Inventors:
MADARAME TAKESHI
SHIMIZU HIROSHI
SHIBATA KATSUJI
MATSUO AYAKO
Application Number:
JP32300798A
Publication Date:
May 30, 2000
Filing Date:
November 13, 1998
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/00; C08G59/30; C08G59/62; C09K13/06; H05K3/46; (IPC1-7): H05K3/46; C08G59/30; C08G59/62; C09K13/06; H05K3/00
Domestic Patent References:
JPH08330742A1996-12-13
JPH06280054A1994-10-04
JPH0572165U1993-09-28
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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