PURPOSE: To enable the formation of a high-density wiring circuit by connecting printed wiring boards for inner layers by means of a semithrough hole and a through hole.

CONSTITUTION: A laminated board 1 clad with copper is made, and a through hole 2a is formed. Next, a copper-plated layer 3 and a through hole 2 are made. Next, a wiring circuit 4 is made. Next, a photosensitive insulating resin layer 5 is applied all over the surface layer of the laminated substrate 1 clad with copper by roller coating method, and the photosensitive insulating resin layer 5 is exposed and developed. Next, a plated resist layer 6 is made on the surface layer of the copper-lined laminated layer board 1, and a specified wiring circuit part is exposed and developed. Next, a wiring circuit 4 is made by electroless plating method, and the needless plated resist layer 6 is removed. Next, a resin layer 5 is made, and a semithrough hole 7a is made in the specified position. Next, a plated resist layer 6 is made, and the plated resist layer 6 is exposed and developed. Next, a semithrough hole 7 and an outermost-layer circuit 8 are made, and the needless plated layer 6 is removed.