Title:
MANUFACTURE OF MULTILAYER THIN FILM CAPACITOR
Document Type and Number:
Japanese Patent JPH05121262
Kind Code:
A
Abstract:
PURPOSE: To enhance bonding force of an insulating substrate and external electrodes and to reduce cost in a method for manufacturing a multilayer thin film capacitor.
CONSTITUTION: A method for forming a multilayer thin film capacitor's external electrode 5 made mainly of a copper thin film by plasma flame spraying using a plasma flame as the heat source which is a mixture of argon gas and hydrogen gas at a volume ratio of 1-10% enables an external electrode 5 and an insulating substrate 1 to be strengthened in bonding force and material cost to be reduced, so that the manhour can be shortened with no need of treatment steps before and after the external electrode 5 is formed.
Inventors:
KONDO TOSHIFUMI
HAGA MIKIO
SUGIMOTO TAKANORI
MORI TATSUAKI
HAGA MIKIO
SUGIMOTO TAKANORI
MORI TATSUAKI
Application Number:
JP27602491A
Publication Date:
May 18, 1993
Filing Date:
October 24, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C23C4/12; H01G4/06; H01G4/232; H01G4/30; H01G4/33; (IPC1-7): C23C4/12; H01G1/147; H01G4/06; H01G4/30
Attorney, Agent or Firm:
Akira Kobiji (2 outside)