PURPOSE: To improve the productivity of a printed wiring board, and reduce the formation time, by stacking fast-curing prepreg containing specific compound on both sides of a circuit-worked double-sided copper clad lamination board, and performing lamination-pressing.

CONSTITUTION: Thermosetting type or photo-setting type or photo-thermosetting type undercoat material is spread on both surfaces of an inner layer circuit board, and copper foil step-difference of the inner layer circuit is eliminated or reduced. On both surfaces, fast-curing prepreg is stacked and lamination- pressed which material contains the following; epoxy resin containing two or more epoxy groups in a molecule, polyfunctional phenol, dicyandiamine and guanido compound. The equivalent ratio of the epoxy resin compound for 1 equivalent of epoxy resin having two or more epoxy groups in a molecule is polyfunctional phenol 0.5-1.2 equivalent, dicyandiamine 0.02-0.4 equivalent, and guanido compound 0.03-0.5 equivalent.