Title:
MANUFACTURE OF NICKEL PLATED COPPER WIRE
Document Type and Number:
Japanese Patent JPS6187896
Kind Code:
A
Abstract:
PURPOSE:To prevent the cracking and stripping of a film on a copper wire during secondary working such as elongation or twisting by plating the wire with nickel in a sulfamate bath contg. specified amounts of nickel sulfamate, nickel chloride and boric acid. CONSTITUTION:The copper wire is plated with nickel in the sulfamate bath contg. 400-750g/l, especially 700g/l nickel sulfamate, <10g/l, especially <6g/l nickel chloride and 10-40g/l, especially 30g/l boric acid. The pH of the bath is adjusted to 3-5.5, especially 4-5. A brightener, a pitting inhibitor and other additives may be added to the bath.
Inventors:
MAEJIMA SEIJU
SAITO TAKESHI
KIYOTA SHINICHI
BABA NORIYASU
TAKEMURA HIROHITO
ITO YUTAKA
SAITO TAKESHI
KIYOTA SHINICHI
BABA NORIYASU
TAKEMURA HIROHITO
ITO YUTAKA
Application Number:
JP21719185A
Publication Date:
May 06, 1986
Filing Date:
September 30, 1985
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
C25D3/12; C25D5/24; C25D7/06; (IPC1-7): C25D7/06; C25D3/12
Other References:
MODERN ELECTROPLATING=1967
Attorney, Agent or Firm:
Masatake Shiga
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