PURPOSE: To obtain a one-sided metal-clad laminated board whose interlayer exfoliation defect is small when an outer layer is formed by a method wherein a prepreg face of a one-sided metal-clad laminated-sheet constitution body composed of a specific prepreg sheet and of a metal foil placed on its one side is arranged so as to be faced, via a sheet of mold- releasing paper whose surface has been roughened, with a prepreg face of another similar one-sided metal clad laminated-sheet constitution body and both sides are heated and pressurized.

CONSTITUTION: A thermoset resin whose glass transition temperature is at 60 to 90% of a glass transition temperature at perfect hardening is arranged so as to be faced with the side of a prepreg sheet face of a one-sided metal-clad laminated-sheet constitution body which is composed of one to several prepreg sheets impregnated with a base material and of a metal foil placed on its one side in such a way that they sandwich a sheet of mold releasing paper whose surface has been roughened; the whole is heated and pressurized via a mirror-finished plate; a hardening reaction is stopped at the intermediate stage in a process in which the reaction progresses; and the mold releasing paper or a mold releasing film for roughened surface formation use is held on the side of a one-sided copper-clad laminated sheet until the sheet is used as a multilayer circuit board. As a result, it is possible to prevent the resin from absorbing moisture and to form the one-sided copper-clad laminated sheet in which a deterioration of the resin is small and whose curl is small. Thereby, it is possible to reduce that an interlayer exfoliation is caused.