Title:
MANUFACTURE OF OPTICAL MODULE
Document Type and Number:
Japanese Patent JPH04151880
Kind Code:
A
Abstract:
PURPOSE:To obtain a small-sized, highly reliable optical module at a low cost, by retaining a transparent molded object, in the inside of an opaque molded object, so as to interpose a part of a lead frame group and a space part. CONSTITUTION:Transfer mold as a first stage molding is performed so as to set a lead frame group 54 as a reference and cover a light emitting (light detecting) element 60, an IC element 55, and bonding wires with transparent cured epoxy resin, thereby forming a transparent molded object 57 having a condenser lens 57a on an optical axis of the light emitting (light detecting) element 60. The transparent molded body 57 and a part of lead frame group 54 are fixed by a first metal mold 71 and a second metal mold 72 corresponding to the cylindrical inner wall part of an optical connector coupling part 59. By using other metal mold capable of forming an external shape, a second stage molding is performed with black thermosetting epoxy resin to form an opaque molded object 52. Thereby a small-sized, highly precise optical module can be obtained at a low cost.
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Inventors:
KATAGIRI SHUHEI
TSUCHINUMA KENICHI
OHASHI MAKOTO
TSUCHINUMA KENICHI
OHASHI MAKOTO
Application Number:
JP4128990A
Publication Date:
May 25, 1992
Filing Date:
February 23, 1990
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
G02B6/42; H01L21/56; H01L33/54; H01L33/56; H01L33/62; (IPC1-7): G02B6/42; H01L21/56; H01L33/00
Domestic Patent References:
| JPS6244831A | 1987-02-26 |
Attorney, Agent or Firm:
Noriyuki Noriyuki (1 person outside)