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Title:
MANUFACTURE OF OVERLAIED WOODY LAMINATED LUMBER BOARD
Document Type and Number:
Japanese Patent JPH0379302
Kind Code:
A
Abstract:

PURPOSE: To obtain a laminated board which is excellent in surface appearance, surface property, and durability by pre-treating the front surface or rear surface of a woody laminated board with a specific molecular weight melamine resin and putting an overlaied base material impregnated with melamine resin and then dried thereon for thermocompression-forming them.

CONSTITUTION: On the front surface or rear surface of a woody laminated board of 2mm or more in its thickness, melamine resin of 1200 or less in its molecular weight is applied in order that the applied quantity after drying becomes 10-40g/m2 per unit area and 6-20wt.% for volatilization as pre-treatment. Next, on an overlaid base material which becomes transparent after thermocompression-forming and is made of non-woven fabric or woven fabric such as chemical fibers, glass fibers and the like, a substance impregnated and then dried with melamine resin of 2000 or less in its molecular weight with respect to the overlaid base material of 100 pts.wt. in the adhering quantity of 250-450 pts.wt. and 6-20wt.% for volatilization is superimposed and then formed under the thermal conditions of the temperature of 100-160°C and the presence of 10-30kg/cm2.Whereby a woody laminated board can be obtained which is excellent in abrasion resistance, crack resistance, anti-moisture absorption property, anti-contamination property or the like and given a uniform surface reinforced finish.


Inventors:
KURI SHINICHI
KATO HIDEKI
KAWAHARA RYOZO
NAMISAKI HIROMITSU
Application Number:
JP21682889A
Publication Date:
April 04, 1991
Filing Date:
August 23, 1989
Export Citation:
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Assignee:
AICA KOGYO CO LTD
International Classes:
B27K5/00; B27K5/02; (IPC1-7): B27K5/00; B27K5/02
Domestic Patent References:
JP58079589B
JPS50157464A1975-12-19
JPS5432607A1979-03-10



 
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