Title:
圧電基板の製造及び関連の方法
Document Type and Number:
Japanese Patent JP5486823
Kind Code:
B2
Abstract:
The present invention relates to methods, and related systems and devices, for fabricating selectively patterned piezoelectric substrates suitable for use in a wide variety of systems and devices. A method can include providing a piezoelectric substrate having a protrusion of substrate material, depositing an electrically conductive coating so as to cover a portion of a side of the substrate and protrusion, and removing a portion of the coated protrusion.
Inventors:
Charles Di Melville
Richard S. Johnson
Richard S. Johnson
Application Number:
JP2009046639A
Publication Date:
May 07, 2014
Filing Date:
February 27, 2009
Export Citation:
Assignee:
UNIVERSITY OF WASHINGTON
International Classes:
H01L41/332; H01L41/047; H01L41/087; H01L41/09; H01L41/29
Domestic Patent References:
| JP9083030A | ||||
| JP2007096283A | ||||
| JP10144974A | ||||
| JP2004106458A | ||||
| JP2007329460A | ||||
| JP2008511039A | ||||
| JP2008531112A |
Foreign References:
| WO2007080734A1 | ||||
| WO2006022557A1 | ||||
| WO2006096155A1 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa