Title:
MANUFACTURE OF PRESSURE SENSOR
Document Type and Number:
Japanese Patent JPS63117233
Kind Code:
A
Abstract:
A method of bonding two silicon wafers each having a capacitive plate. Two highly-doped electrically semiconductive feedthrough paths are formed through one wafer, each path contacting one of the capacitive plates. A glass layer is formed on one of the silicon wafers where bonding is desired between the two wafers. The glass layer is anodically bonded to the other of the silicon layers.
Inventors:
MATEI MITSUKOAA
Application Number:
JP27462587A
Publication Date:
May 21, 1988
Filing Date:
October 29, 1987
Export Citation:
Assignee:
FORD MOTOR CO
International Classes:
G01L9/12; B81B7/00; G01L9/00; (IPC1-7): G01L9/12
Attorney, Agent or Firm:
Akira Asamura (2 outside)