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Patent Searching and Data


Title:
MANUFACTURE OF PRINTED BOARD, PHOTO SOLDER RESIST AND SOLDER RESIST INK
Document Type and Number:
Japanese Patent JPH03161993
Kind Code:
A
Abstract:

PURPOSE: To obtain a printed board wherein a permanent protective film on which characters and the like have appeared is formed, by sequentially performing pattern forming process, photo solder resist film forming process, coating film forming exposure process, character and the like appearance and exposure process, and post-treating process.

CONSTITUTION: A wiring pattern 3 is formed on a board 2; a photo solder resist coating film 5 is formed on the board 2 containing the wiring pattern 3; a positive film 9 wherein an image 8 for forming a permanent protective film 7 is formed and a wavelength selecting filter 10 arranged on the film 9 are positioned on the coating film 5, and exposed to light, thereby forming the permanent protective film 7. The light having a wavelength different from the wavelength which has been used for forming the protective film 7 is projected on the protecting film 7, and appearing exposure is performed by using a film 12 turning to symbols, characters, etc. Thus symbols, characters, and the like 13 subjected to color development or color elimination or color change are made to appear. By performing post- treatments of developing, water washing, drying, etc., the photo solder resist of the part of the board 2 which has not yet been cured is exfoliated. Thereby a printed board 18 wherein a permanent protective film 7 on which symbols, characters, etc., have appeared is formed can be obtained.


Inventors:
IINO TATSUYA
ANDO MASAHIKO
Application Number:
JP30154289A
Publication Date:
July 11, 1991
Filing Date:
November 20, 1989
Export Citation:
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Assignee:
TOKYO PROCESS SERVICE
International Classes:
G03F7/004; H05K3/00; H05K3/28; (IPC1-7): G03F7/004; H05K3/00; H05K3/28
Attorney, Agent or Firm:
Mitsuyasu Miura