MANUFACTURE OF PRINTED-CIRCUIT BOARD

Japanese Patent JPH01124287

A

PURPOSE:To manufacture a high-density printed-circuit board whose adhesion force between a circuit and an insulating substrate is excellent in a simple process by a method wherein a copper thin layer is formed on a provisional support base material and is brought into contact with a treatment liquid containing an oxidizing agent so as to transform the copper thin layer into copper oxide, an insulating organic material is laminated on a copper oxide face, the support base material is removed, this assembly is brought into contact with a solution of a reducing agent and, after that, a conductive metal is plated. CONSTITUTION:A copper thin layer 2 is formed on a Teflon tape 1; the copper thin layer 2 is transformed into copper oxide 3. Then, an insulating organic glass cloth is pressure-laminated to an epoxy prepreg material 4; the Teflon film 1 is stripped off and removed; this assembly is immersed in an aqueous solution of a reducing agent for 10 minutes and the copper oxide layer is reduced. Then, an electroless plating operation 5 is executed; a resist pattern 6 is formed; after that, copper is electroplated; a copper pattern 7 with a thickness of 30mum is formed in a desired part. Then, the resist pattern 6 is stripped off by using methylene chloride; the electroless plated layer 5 and one part of a reduction-generated and/or copper oxide layer 2' are etched by using a solution of ammonium persulfate; a desired wiring pattern 7 is obtained.

TSUBOMATSU YOSHIAKI
FUKUTOMI NAOKI
NAKASO AKISHI
IWASAKI YORIO
KIDA AKINARI

JP28263387A

May 17, 1989

November 09, 1987

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HITACHI CHEMICAL CO LTD

H05K3/18; H05K3/38; (IPC1-7): H05K3/18; H05K3/38

Hirose Akira

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