Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2833601
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To form a division groove and a through hole at the same time with ease, by applying a photosensitive resin on an inner layer core material where a circuit is already formed, and performing exposure and development through a photo method with a mask film so that a photo-via hole and cutting groove are formed at the same time.
SOLUTION: A photosensitive insulation resin 5 is applied on a core layer 4, on its both sides, formed of a conductor pattern 1 and a photo-via land 2, then a mask film 8 is laid over it, for exposure under UV light irradiation. Then, with development in butyl group solvent, a photo via hole and a division groove are formed at the same time, and a photo-via is formed with electroless copper plating and electric copper plating. A core with a single built-up on both sides is applied with the photosensitive insulation resin again on both sides, and a photo-via hole and a division groove are formed in the same process as before, and development is performed till the division groove reaches the core layer 4 while copper plating is performed likewise to form a photo-via, thus, a division groove of arbitrary shape is formed at arbitrary place at the same time when a photo-via hole is formed.
Inventors:
KIKUCHI HIDEKI
Application Number:
JP31758796A
Publication Date:
December 09, 1998
Filing Date:
November 28, 1996
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H05K3/00; H05K3/46; (IPC1-7): H05K3/46; H05K3/00
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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