Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3132939
Kind Code:
B2
Abstract:
PURPOSE: To enable a printed wiring board having extremely good sensitivity and high resolution to be fabricated even from a double-sided copper-clad laminate having a through-hole, by causing a photoconductive layer to contain a binding resin composed of a specified polymeric component and a photoconductive compound, and specifying the content of the polymeric component in the binding resin.
CONSTITUTION: On a metal conductive layer of a conductive board, a photoconductive layer is provided by an electrodeposition process, on which a toner image is further formed by electrophotography, the photoconductive layer except the portion on which the toner is deposited is dissolved and removed, and the board surface in the portion where the photoconductive layer has been removed is etched. In this case, the photoconductive layer is made up of a binding resin composed of a polymeric component containing at lease one monomer I in acrylic acid benzyl ester and methacrylic acid benzyl ester which may have a substituent in the aromatic ring and a monomer II having a carboxyl group in the molecules and vinyl-polymerizable, a photoconductive compound. The contents of I and II in the binding resin are 20 to 60wt.% and 10 to 30wt.%, respectively.
Inventors:
Wakana Inoue
Kenji Hyodo
Kenji Hyodo
Application Number:
JP2039293A
Publication Date:
February 05, 2001
Filing Date:
February 08, 1993
Export Citation:
Assignee:
Mitsubishi Paper Mills Co., Ltd.
International Classes:
C23F1/00; G03F7/004; G03F7/027; G03F7/028; G03F7/30; G03G5/00; G03G5/04; G03G13/26; H05K3/06; (IPC1-7): H05K3/06; G03F7/004; G03F7/027; G03F7/028; G03F7/30; G03G5/00; G03G5/04; G03G13/26
Domestic Patent References:
| JP63129689A | ||||
| JP5666863A |