Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3244782
Kind Code:
B2
Abstract:
PURPOSE: To manufacture a printed wiring board having extremely good sensitivity even from a both-sided copper-pasted lamination plate such as having through holes while having high resolution.
CONSTITUTION: In the manufacture of a printed wiring board utilizing a photographic method, a dielectric layer is formed on a conductive metal substrate or inside a through hole by an electrodeposition so as to form a toner picture on the formed dielectric layer by an electronic photographic method for solving and removing a light-conductive layer of a non-picture part and manufacturing the printed wiring board by performing etching.
Inventors:
Kenji Hyodo
Application Number:
JP18954592A
Publication Date:
January 07, 2002
Filing Date:
July 16, 1992
Export Citation:
Assignee:
Mitsubishi Paper Mills Co., Ltd.
International Classes:
G03F7/20; G03G13/26; H05K3/06; (IPC1-7): H05K3/06; G03F7/20; G03G13/26
Domestic Patent References:
JP63129689A | ||||
JP470887A | ||||
JP62262855A | ||||
JP4186791A | ||||
JP1124879A |
Previous Patent: eyeglass fixings
Next Patent: APPARATUS AND METHOD FOR ALIGNING, ALIGNER APPARATUS USING THE SAME AND MANUFACTURE OF SEMICONDUCTOR...
Next Patent: APPARATUS AND METHOD FOR ALIGNING, ALIGNER APPARATUS USING THE SAME AND MANUFACTURE OF SEMICONDUCTOR...