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Patent Searching and Data


Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0371698
Kind Code:
A
Abstract:

PURPOSE: To obtain a printed wiring board which always displays maintains a highly reliable electromagnetic shielding property by a method wherein an electromagnetic shielding layer is provided as an inner layer or built in a required printed wiring board by a laminate molding process.

CONSTITUTION: An electromagnetic shielding layer 2 is deposited on the required face of an insulating support 1. Then, copper foils 4 as conductive foils are laid on both the primary faces of the insulating support 1 where the electromagnetic shielding layer 2 has been provided, which is subjected to a laminate molding process through a conventional means to obtain a printed wiring board. The printed wiring board concerned is successively subjected to a required through-hole processing, a circuit pattern processing in which the copper foils 4 is photoetched, a plating process, and others, whereby a target electromagnetic shielding type printed wiring board can be obtained. By this setup, a complicated insulating layer forming work after the formation of a required circuit pattern can be simplified and a wiring board of high reliability can be obtained.


Inventors:
Endo, Akira
Application Number:
JP1989000207419
Publication Date:
March 27, 1991
Filing Date:
August 10, 1989
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H05K9/00; H05K1/02; H05K3/46; (IPC1-7): H05K9/00