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Patent Searching and Data


Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH04267397
Kind Code:
A
Abstract:

PURPOSE: To preserve the reliability on the insulation between parts mounting pads and prevent the drop of reliability on soldering by providing a liquid-form solder resist at the parts mounting pad of an insulating board and in its vicinity, and dry solder resist for masking the other parts.

CONSTITUTION: The parts mounting pad 2 of an insulating board and its vicinity are coated with liquid-form solder resist 4, and after set to touch, it is exposed to UV and developed and thermoset to form cured liquid-form solder resist 6. Next, dry film resists 7 are laminated on both sides of the insulating board 1, and through films 5, both sides are exposed to UV at the same time and are developed to make a hardened dry film solder resist 8 by UV curing and thermocuring.


Inventors:
ISHIDOU KIMINORI
Application Number:
JP2847891A
Publication Date:
September 22, 1992
Filing Date:
February 22, 1991
Export Citation:
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Assignee:
NEC CORP
International Classes:
H05K3/28; G03F7/16; H05K3/00; (IPC1-7): H05K3/28
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)