PURPOSE: To form a conductor circuit wherein its insulation resistance is large, its insulation reliability is increased, it utilizes the advantage of an additive method and its density is high by a method wherein the amount of a catalyst existing between a plated resist layer and an adhesive layer is made small.

CONSTITUTION: In the manufacturing method of a printed wiring board by means of an additive method, the surface of an adhesive layer 2 formed on the surface of a base material 1 is endowed with a catalyst 3, the surface of the adhesive layer 2 is then washed by water under a pressure which is a pressure or higher in a washing operation by water after the developing operation of a plated resist, a plated resist layer 4 is then formed, an activation treatment is executed to the catalyst 3, and a chemically plated layer 5 is then formed.