PURPOSE: To obtain a wiring board with high accuracy and superior heat resistance by joining a photosensitive resist film contg. a diallyl phthalate prepolymer with a specified mol.wt., a photopolymerizable monomer and a photopolymn. initiator as principal components to a laminated board coated with an adhesive contg. a catalyst, and using the resulting material.
CONSTITUTION: A photosensitive resist film contg. a diallyl phthalate prepolymer with about 3,000Wabout 20,000mol.wt., a photopolymerizable monomer and a photopolymn. initiator as principal components is superposed on a laminated board coated with an adhesive contg. a catalyst after piercing holes in the board by drilling or other method, and they are joined together by heating and pressurization. The film is exposed through a transparent negative, optionally heat- treated, and developed. The developed film is cured by heat treatment or irradiation with ultraviolet rays. Electroless copper plating is carried out using the resulting permanent insulating film as a mask to form a conductor circuit, and finally irradiation with ultraviolet rays or heat treatment is carried out. Thus, a printed wiring board having superior solvent resistance and proof against soldering temp. is obtd. by repeating heat treatment or irradiation with ultraviolet rays twice.
TAZAWA KENJI
JPS5388956A | 1978-08-04 | |||
JPS5343081A | 1978-04-18 | |||
JPS4855926A | 1973-08-06 | |||
JPS52134643A | 1977-11-11 | |||
JPS5638311A | 1981-04-13 | |||
JPS58199341A | 1983-11-19 |
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