PURPOSE: To inexpensively manufacture a semiconductor device in a high efficiency by bending electrode leads projected from a die body along the body, engaging the device with a recess formed on the side, and cutting the electrode leads before bending by a punch.

CONSTITUTION: Semiconductor devices 4 connected to each other are supplied to recesses 32, 27 of a die 23, one drive art is shortened, an upper die 24 is contacted under pressure with a lower die 25, the die 24 is further lowered so that electrode leads 8 projected sidewisely from both recesses 32, 27 are disposed to be placed on the upper surface of a die 21. Then, other drive arm 27 is shortened to lower punches 33, and the electrode leads 8 are cut so that the cutting blade 39 of the punch 33 is engaged within a through hole 38 of the die 21.