Title:
MANUFACTURE OF RESIN SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2001077266
Kind Code:
A
Abstract:
To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing.
After a metal sheet 13 having an adhesive 14 is bonded to a lead portion 4 and resin sealed, leads are cut with a blade. Then, by peeling off the metal sheet 13 together with the adhesive 14, bent portions 12 (metal burrs) generated on the cut end surface of the lead portion 4 can be removed and a resin sealed semiconductor device wit high mounting reliability can be obtained.
Inventors:
MATSUO TAKAHIRO
OHIRO MASAHIKO
MARUO TETSUMASA
OHIRO MASAHIKO
MARUO TETSUMASA
Application Number:
JP24753499A
Publication Date:
March 23, 2001
Filing Date:
September 01, 1999
Export Citation:
Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
H01L21/56; H01L23/50; (IPC1-7): H01L23/50; H01L21/56
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
Previous Patent: 燃料電池システム用燃料
Next Patent: SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE
Next Patent: SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE