Title:
MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR ELEMENT USING LEAD FRAME
Document Type and Number:
Japanese Patent JPH06349990
Kind Code:
A
Abstract:
PURPOSE: To provide a method for manufacturing a resin-sealed semiconductor element using a lead frame in which a surface mount semiconductor element can be manufactured with high productivity of a product with high reliability.
CONSTITUTION: A semiconductor chip 2 is mounted on a chip amount 2a of a lead frame 1 in which outer leads 1b are previously bent as prescribed, the chip is bonded to the leads via wires 3, a periphery of the chip is then sealed with resin 4 in the frame, a tie bar 1c is further cut to divid into individual elements. Thus, a defect of a resin package due to a stress caused by bending the lead can be avoided.
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Inventors:
MARUYAMA ATSUSHI
Application Number:
JP13969493A
Publication Date:
December 22, 1994
Filing Date:
June 11, 1993
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L23/48; (IPC1-7): H01L23/48
Attorney, Agent or Firm:
Iwao Yamaguchi