Title:
MANUFACTURE OF RESIN SEALING-TYPE ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3594489
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To manufacture a resin sealing-type electronic part having high reliability even if the thicknesses of upper/lower resin parts differ by arranging a semiconductor device or the electronic part in a die, setting a granular epoxy resin molding material to be sealing resin, compressing/molding resin and sealing it while the inner part of the die is made to a vacuum.
SOLUTION: A compression molding method is adopted so that the resin quantity of upper/lower resin sealing parts 1 and 2 divided by a substrate or a lead frame 5 can easily be controlled. Then, a granular epoxy sealing resin is adopted so that upper/lower resin quantities are easily distributed. A pressure reduction/molding method for reducing pressure from a pressure reducing port 8 for degassing air between granular resins is adopted, and a semiconductor device 6 or an electronic part is resin-sealed. The unbalance of the filling of upper/lower resins can be prevented by adopting the compression/molding method. Thus, the occurrence of an inner void and an outer void, which occur in a molded good, can be prevented by adopting the pressure reduction/molding method for reducing pressure in a cavity and molding resin is adopted.
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Inventors:
Akira Yoshizumi
Application Number:
JP20430698A
Publication Date:
December 02, 2004
Filing Date:
July 03, 1998
Export Citation:
Assignee:
Kyocera Chemical Co., Ltd.
International Classes:
H01L21/56; (IPC1-7): H01L21/56
Domestic Patent References:
| JP2257662A | ||||
| JP8288429A | ||||
| JP4361537A | ||||
| JP8111465A |
Attorney, Agent or Firm:
Saichi Suyama
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