PURPOSE: To form a multilayer wiring structure, composed of resinous insulating layers and metallic wiring layers on a ceramic substrate, in less processes in the manufacture of a resinous multilayer wiring board.

CONSTITUTION: Resinous insulating layers 4, 6 and 8 are formed by applying uncured photosetting resin to a ceramic substrate 1, and curing the resin by light irradiation through light beam 12 scanning. In the formation of the resinous insulating layers 4 and 6, a buyer hole 9 is made together by providing unirradiated regions 13 before light irradiation. In the resinous insulating layers 4 and 6, opticalsetting resin is applied a plurality of times, and light is irradiated after each application. Each time light is irradiated, the diameter of the unirradiated regions 13 is gradually enlarged to taper the buyer hole 9. Wirings 5 and 7 of metallic wiring layers are formed by activating regions where those wirings are to be formed on the surface of the resinous insulating layers 4 and 6 by selectively irradiating the regions, where the wirings are to be formed, with a light beam 14 scanning to activate the regions, and selectively depositing metal on the activated regions by electroless plating.