Title:
MANUFACTURE OF RIGID FLEX WIRING BOARD
Document Type and Number:
Japanese Patent JP3209772
Kind Code:
B2
Abstract:
PURPOSE: To prevent a plating liquid used for plating treatment of a through- hole from infiltrating into a flexible substrate by allowing a rigid substrate laminated on the flexible substrate to be cut to half from an inside by a groove- forming process.
CONSTITUTION: Machining is made on a rigid substrate 2 where a mold relief paper 4 and an adhesive layer 3 are laminated by a Thomson blade 5. In this case, the Thomson blade 5 penetrates through the mold relief paper 4 and the adhesive layer 3 and further cuts into a middle portion of the rigid substrate 2. Namely, the rigid substrate 2 which is laminated on the flexible substrate 1 is cut to half from an inside previously by a groove-forming process, thus preventing a plating liquid used for plating treatment of a through-hole from infiltrating into the flexible substrate 1 at least from outside in a process for forming a through-hole after laminating the flexible substrate 1 and the rigid substrate 2.
Inventors:
Shinichi Kiyota
Koji Osawa
Koji Osawa
Application Number:
JP34343191A
Publication Date:
September 17, 2001
Filing Date:
December 25, 1991
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
H05K3/46; H05K3/00; (IPC1-7): H05K3/46
Domestic Patent References:
| JP2121390A | ||||
| JP3141694A | ||||
| JP2229492A | ||||
| JP3262195A | ||||
| JP6375074U |
Attorney, Agent or Firm:
Masatake Shiga
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