PURPOSE: To prevent a disconnection while forming a MESFET by a simple manufacturing process by laminating and shaping a protective film and a mask layer on a substrate, forming source and drain regions through the mask layer and the protective film and thermally treating the whole.
CONSTITUTION: A protective film 8 and a mask layer 11 are laminated and formed on the surface of a substrate 1, and ions are implanted continuously through the mask layer 11 and the protective film 8 to shape an N layer 12. Source-drain regions 13, 14 consisting of N+ layers are formed simultaneously on the surface of the substrate except a section under the mask layer 11, and the whole is thermally treated under the state in which the surface of the substrate is protected by the protective film 8. Accordingly, a MESFET can be manufactured through a simple manufacturing process while the surface of the substrate need not be etched in order to form a Schottky electrode, etc., the surface of the substrate is kept flat, and the disconnection of an electrode wiring can be removed.