Title:
MANUFACTURE OF SEMICONDUCTOR CHIP PACKAGE
Document Type and Number:
Japanese Patent JP3399988
Kind Code:
B2
Abstract:
PURPOSE: To provide a method for processing a semiconductor chip package which processes a semiconductor chip package, without causing cracks and lack in a molding mixture.
CONSTITUTION: In a method of removing a dam bar 15 from a lead 17 for a semiconductor chip package 10, first, a junction between the dam bar 15 and an excessive molding mixture 12 is separated from a molding mixture 11. This junction is broken by a slight movement of the dam bar 15. Then, by moving the dam bar 15 again, the dam bar 15 is completely removed without causing lack or cracks on the molding mixture 11.
Inventors:
Alex Elliott
Allen Coosa
Allen Coosa
Application Number:
JP27670892A
Publication Date:
April 28, 2003
Filing Date:
September 22, 1992
Export Citation:
Assignee:
MOTOROLA INCORPORATED
International Classes:
H01L21/56; H01L21/48; H01L21/98; H01L23/495; H01L23/50; (IPC1-7): H01L21/56; H01L23/50
Domestic Patent References:
| JP29156A | ||||
| JP58223357A |
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)
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