PURPOSE: To remove burrs around a chip.
CONSTITUTION: The manufacturing method of semiconductor chips is constituted so as to be featured in the following manner. An adhesive tape is pasted on the rear of a semiconductor wafer on which many semiconductor elements have been arranged in a matrix shape. While the tape-pasted face is being vacuum-sucked, a dicing operation is executed along boundaries of said semiconductor elements. The wafer is divided into a plurality of chips. After that, while each chip 7 is being vacuum-sucked by using a quadrangular pyramid- shaped holder 4 in which a suction face 5 is formed so as to be recessed from a frame body part 6 in the periphery and into and to which one part of the chip 7 is inserted and fixed when the chip 7 is vacuum-sucked, a burr on the rear is removed.