MANUFACTURE OF SEMICONDUCTOR DEVICE HAVING HEAT DISSIPATION FIN FOR SEMICONDUCTOR ELEMENT COOLING AND RESIN COMPOSITION FOR HEAT DISSIPATION FIN

Title:

MANUFACTURE OF SEMICONDUCTOR DEVICE HAVING HEAT DISSIPATION FIN FOR SEMICONDUCTOR ELEMENT COOLING AND RESIN COMPOSITION FOR HEAT DISSIPATION FIN

Document Type and Number:

Japanese Patent JPH06275668

Kind Code:

A

Abstract:

PURPOSE: To improve the heat dissipation property of a semiconductor device provided with heat dissipation fins for cooling a semiconductor element in a package, in which the element is sealed and which is made of a resin, integrally with the package made of resin as well as to prevent separation of the element due to the thermal expansion of a material or the like from being generated.

CONSTITUTION: In a semiconductor device 4, a resin bonding agent is applied on the surface, which is previously mounted with a semiconductor element, of a lead frame and after the bonding agent is semicured, a package 5 and heat dissipation fins 6 are molded or the fins 6 are formed of a resin composition containing a specified epoxy resin, a curing material, a filling material, a flexibility imparting agent and a curing catalyst.

Inventors:

TAKIGAWA YUKIO
NAKADA YOSHIHIRO
YAGI SHIGEAKI
SONO RIKURO
YAMAGISHI YASUO

Application Number:

JP5866693A

Publication Date:

September 30, 1994

Filing Date:

March 18, 1993

Export Citation:

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Assignee:

FUJITSU LTD

International Classes:

B29C45/02; B29C45/14; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02

Attorney, Agent or Firm:

Shoichi Ui (3 others)

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