Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURING DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP3241649
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a semiconductor device which eliminates any standby state of a die bonding section and thus enables simplification of structure and reduction in the cost.
SOLUTION: A device includes a nozzle 25 for applying a junction material to a die pad of a lead frame 41, a multi-purpose recognition camera 28 for detecting position of a semiconductor chip 37 on a wafer 35 and the position of the lead frame 41, a collet 29 for carrying out die bonding of the semiconductor chip 37, and two-dimensional operation tables 21 and 23 which have the nozzle 25, the multi-purpose recognition camera 28 and the collet 29 mounted thereon and are movable in the horizontal direction.
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| JP2022071993 | ELECTRONIC COMPONENT BONDING APPARATUS |
Inventors:
Masahiko Ohhiro
Koji Masui
Tomoyuki Tanaka
Shoichi Tanaka
Zenichiro Tabuchi
Tsugio Murayama
Koji Masui
Tomoyuki Tanaka
Shoichi Tanaka
Zenichiro Tabuchi
Tsugio Murayama
Application Number:
JP32980797A
Publication Date:
December 25, 2001
Filing Date:
December 01, 1997
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/52; (IPC1-7): H01L21/52
Domestic Patent References:
| JP4106939A | ||||
| JP10199903A |
Attorney, Agent or Firm:
Akio Miyai
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