Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3215131
Kind Code:
B2
Abstract:
PURPOSE: To improve a heating efficiency of a substrate and to improve a cooling efficiency of a susceptor.
CONSTITUTION: An apparatus for manufacturing a semiconductor device comprises a placing base 20 to be placed with a substrate α, substrate heating means 10 opposed to the surface of the substrate α for heating the substrate a with an infrared ray, and a reflecting mirror 30 disposed between the rear surface of the substrate α and the base 20 for reflecting the infrared ray.
Inventors:
Narihiko Kaji
Application Number:
JP26039091A
Publication Date:
October 02, 2001
Filing Date:
October 08, 1991
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
C23C14/50; C23C16/46; C30B25/10; H01L21/205; H01L21/26; H01L21/285; H01L21/31; (IPC1-7): H01L21/26; H01L21/205; H01L21/285; H01L21/31
Domestic Patent References:
| JP336272A | ||||
| JP1196837A | ||||
| JP63308327A | ||||
| JP1130151U | ||||
| JP220324U |
Attorney, Agent or Firm:
Hidekazu Miyoshi (4 outside)
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