PURPOSE: To enable assembly process to be simplified and packaging density of a module to be improved by mounting a lower-stage chip onto a substrate with a surface for forming an electrode facing downward and by mounting on the lower-stage chip an upper-stage chip with the surface for forming the electrode facing upward.
CONSTITUTION: Flip chip bonding is performed onto a wiring on a printed-circuit board 1 with a surface of a lower-stage chip 3 facing downward. Then, an upper-stage chip 4 is placed on a chip 3 and the pad of the chip 4 and wiring on the printed-circuit board are wire-bonded. After this, the chip is covered and resin-sealed. thus completing a module. Therefore, since the chip is directly mounted on the printed-circuit board, assembly process of the device can be simplified and packaging density of the module can be improved.
KOBAYASHI KENJI
KOBAYASHI HITOSHI
