PURPOSE: To provide the manufacturing method of a semiconductor device, in which lead terminals comprising super elastic allay are formed without deteriorating the reliability of the semiconductor device.

CONSTITUTION: A heater 19 is arranged for a forming die 11, a forming punch 13 and a stripper block 16, and heating is performed. When a holder 12 is lowered, a cam 18 is turned in association with the holder, and the forming punch 13 is moved and displaced inward. Thus, lead terminals 3 made of super elastic alloy, which are guided out of a main body 2 of a package, are deformed to the excessive shape than the intended shape. When the punch holder 12 is lifted up, the lead terminals 3 are slightly returned elastically, and the intended bent shape is obtained.