PURPOSE: To provide a manufacturing method for stably forming a high concentration diffusion region, by improving the alignment precision of a source drain, in structure wherein the source drain which is effective in a fine MOS transistor is formed on a semiconductor substrate.
CONSTITUTION: A field oxide film 12 and a gate electrode 6 are formed. A low concentration diffusion region 8 is formed in a semiconductor substrate. A side wall is formed on the gate electrode 6. A source drain 3 is formed on the whole surface. Photosensitive resin 1 is formed on the whole surface by a spin coating method, and then subjected to ashing in an oxygen atmosphere. Only on the low concentration diffusion region 8, the photosensitive resin 1 is patterned in the self-alignment manner. The source drain 3 is patterned by applying the photosensitive resin 1 to an etching mask. Hence the source drain 3 can be formed without alignment error.