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Patent Searching and Data


Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH08181324
Kind Code:
A
Abstract:

PURPOSE: To obtain a TFT which can enhance TFT characteristics such as mobility, a threshold voltage, an S factor and the like, which is excellent in a dielectric breakdown strength frequency characteristic thanks to the removal effect of impurities and particles which are stuck to a surface layer on a polycrystal silicon semiconductor layer.

CONSTITUTION: In the manufacturing method of a semiconductor device, a polycrystal silicon film is formed on a glass substrate 1, the polycrystal silicon film is patterned in a prescribed shape, a semiconductor layer 2 is formed, and a gate insulating film 4 is then formed on the glass substrate 1 and the semiconductor layer 2. In the manufacturing method, before the gate insulating film 4 is formed, the semiconductor layer 2 is cleaned by a mixed solution of ammonia and hydrogen peroxide water, the film thickness of a surface layer 3 on the semiconductor layer 2 which is etched by its cleaning operation is set at 5nm or lower, and, in succession, the semiconductor layer is then cleaned by a mixed solution of hydrochloric acid and hydrogen peroxide water.


Inventors:
MOROSAWA NARIHIRO
Application Number:
JP32548494A
Publication Date:
July 12, 1996
Filing Date:
December 27, 1994
Export Citation:
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Assignee:
SHARP KK
International Classes:
H01L21/304; H01L21/336; H01L27/12; H01L29/786; (IPC1-7): H01L29/786; H01L21/304; H01L21/336; H01L27/12
Attorney, Agent or Firm:
Umeda Masaru