Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5336462
Kind Code:
A
Abstract:
PURPOSE:To avoid cracking of the glass film when it is cut off, by forming an island part at the crossing of the grooves provided on the wafer.
Inventors:
ISHIBASHI KIYOSHI
SHIGEMATSU SHIYOUGO
ITOGA KEIJI
YAMANE MASAHIRO
SHIGEMATSU SHIYOUGO
ITOGA KEIJI
YAMANE MASAHIRO
Application Number:
JP11149776A
Publication Date:
April 04, 1978
Filing Date:
September 16, 1976
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/78