Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5379470
Kind Code:
A
Abstract:
PURPOSE: To reduce the number of the manufacturing process as well as to increase to reliability by forming the necessary etching groove at or near the PN junction through utilization of the finish etching when the glass protective film is formed at the mesa groove.
More Like This:
JPS5360179 | SEMICONDUCTOR DEVICE |
JPS5642367 | MANUFACTURE OF BIPOLAR INTEGRATED CIRCUIT |
Inventors:
SHIMOJIYOU YOSHIHISA
Application Number:
JP15671476A
Publication Date:
July 13, 1978
Filing Date:
December 24, 1976
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L29/73; H01L21/316; H01L21/331; H01L21/56; H01L29/08; H01L29/70; H01L29/74; (IPC1-7): H01L21/316; H01L21/56; H01L29/08; H01L29/70
Domestic Patent References:
JPS5263682A | 1977-05-26 |